ORIGINALS ORIGINALARBEITEN Inverse determination of effective mechanical properties of adhesive bondlines
نویسندگان
چکیده
A new approach for determining effective mechanical bondline properties using a combined experimental–numerical modal analysis technique is proposed. After characterizing clear spruce wood boards, an adhesive layer is applied to the boards’ surfaces. The shift of the eigenfrequencies resulting from the adhesive layer together with information on the bondline geometry can then be used to inversely determine the mechanical properties of the adhesive layer using finite element models. The calculated values for clear wood as well as for the adhesive layer lie within reasonable ranges, thus demonstrating the method’s potential. Inverse Bestimmung von effektiven mechanischen Eigenschaften von Klebfugen Zusammenfassung In dieser Arbeit wird eine neue Untersuchungsmethode zur Bestimmung der effektiven mechanischen Eigenschaften von Klebfugen mittels experimentell-numerisch kombinierter Modalanalyse vorgestellt. Die Schwingungseigenschaften von Fichtenvollholzbrettern werden charakterisiert, bevor und nachdem eine Klebstoffschicht auf die Holzflächen aufgebracht wird. Die durch die Klebstoffschicht bedingte Änderung in den Eigenfrequenzen kann zusammen mit der Klebfugengeometrie genutzt werden, um mittels Finiter Elemente Modelle, invers die mechanischen Eigenschaften der Klebstoffschicht zu bestimmen. Das Potenzial der vorgestellten Methode zeigt sich in den vielversprechenden Ergebnissen, die sowohl für Vollholz als auch für die Klebstoffschicht sinnvolle Werte annehmen.
منابع مشابه
Identification of Dynamic Damping Properties of a Flexible Structural Adhesive
In this paper dynamic damping properties of a nominated flexible structural adhesive have been identified using an extended-direct modal based joint identification method. It has been revealed that damping characteristics of adhesive are correlated to both frequency and mode shape. Young’s and shear moduli increase with frequency but damping on the other hand, decrease. The results showed that ...
متن کاملComposite Adhesive-Bonded Joint Reinforcement by Incorporation of Nano-Alumina Particles
Adhesive bonding technology is being used in a variety of modern industries, including the automotive, aerospace, maritime, construction, defense and so on. On the other side, polymeric nano - composites attracted both academic and industrial interests in the past decades. The scope of this paper is experimental investigation on the effects of the addition of Alpha-alumina nanoparticles to the ...
متن کاملAn Analytical Solution for Inverse Determination of Residual Stress Field
An analytical solution is presented that reconstructs residual stress field from limited and incomplete data. The inverse problem of reconstructing residual stresses is solved using an appropriate form of the airy stress function. This function is chosen to satisfy the stress equilibrium equations together with the boundary conditions for a domain within a convex polygon. The analytical solu...
متن کاملViscoelastic analysis of stress distribution in balanced and unbalanced adhesively bonded single-lap joints with functionally graded adherends under the Reddy model
In this study, shear and peel stress distributions in the viscoelastic adhesive layer of a single-lap joint (SLJ) with functionally graded (FG) adherends are investigated. The study focuses on the effect of different adherend profiles and material composition on the time-dependent stress concentration/distribution in balanced and unbalanced SLJs. For this purpose, the Reddy model is applied to ...
متن کاملEffect of firing temperature on the properties of inorganic high temperature phosphate adhesive
High-temperature adhesives are considered for high-temperature applications such as the refractory industry. In this research, inorganic high-temperature phosphate-based adhesive was prepared using alumina and micro silica as the main raw materials and monoaluminum phosphate as a binder. The effect of firing temperature on the properties of the adhesive including phases, microstructure, compres...
متن کامل